Description

Material Testing Service for Food Industry, Semiconductor / Electronic Industry, with a very fine machine that move in Nano Scale, allowing test of both organic and inorganic

Material Testing Service

Whether you have material for food, semiconductor, or material from PSA production. Tasatec is now offering one stop testing service. With top of the line machine surface testing machine that allow us an evaluation of

• Peel test of PSA Adhesive
• 90Deg/180Deg/45Deg/and 135Deg Tension test
• Compression
• Folding, Bending, Rolling Fatique Test
• Creep/Recovery

We can carry surface test of your material both organic and inorganic using micro-Indentation in Nano scale movement(0.32 to 32 nm)

Scratch / Stress / Strain test now made easy with the Enhanced vision inspections & vision extensometer with very high resolution.

Food Texture profile analysis

Sample thickness under each stress and stress at each contact length can be measured in surface mapping action. All testing modes are real time. – 3D distribution map can be interpreted, in the case of adhesives and PSA (Pressure sensitive adhesive), each sample area can be characterized with only one sample sheet. Transferred residue of PSA Identification of the adhesive tape around the transition phenomenon. Adhesive material adhered due to the weak adhesive strength, and he transfer is very difficult to determine experimentally. If the first transfer occurs due to weakening cohesion, after the second adhesion weakens. This is one of the determination method on indirect transfer phenomenon.

Die strength test

Final test step of Semiconductor packaging process, which is evaluate die shear strength of chip packages. We provide an easy and less expensive result you gain from those Die Strength Tester with controllable temperature of up to  260 DegC

We serve analysis service on Standard test and also non-standard test at the condition of your choice.

To learn more about this testing service, please dial us at 02 030 5852 or Line us at ID:Tasatec