Dicing and DAF(Die attach Film) for Semiconductor / Tape testing
Structure of DDAF that usually tested using General Ball Probe, High/Low Tack pattern of Dicing Tape, Compression, Peel force/Adhesion force, Iniital Tack to find tacking properties – it is now easier with one tester to know ALL properties without the hassle of UV exposure.
Dicing and DAF(Die attach film) tape is widely used for post- manufacturing process of semiconductor including packaging process. Dicing tape is effective for preventing break and damage during chip dicing process, so it is slightly attached on the back side of wafer. Dicinf tape would be perfomed sustain adhesive power to wafer during dicing process and well detach funtion for pick up from the diced chip.
The dicing tape must be contained important PSA(Pressure sensitive adhesive) function such as Tack power, Cohesiveness, Peel power, Tensile strenth of substrate and these are under controlled because on dicing they have enough power, on pick up they have well detach function.
DAF have been gradually used and replaced from Die attach adhesive, which is for die attaching process to PCB. Recently wafer thickness become thin up to 50um below and chip stacking is widely applied on various chip packaging types. So die attach adhesive is no loger used for chip packaging process on thin wafer mounting to substrate and have changed to DAF application. The DAF must be contain strong adhesiveness to substrate after cure process. And before the process DAF have to be able to detached from substrate.
On above background dicing and DAF have to be quality controlled at in/out manufactureing process. Normally three types of test could be perfomed, which are Tack, Peel, tensile test.
A few years ago Dicing/DAF combined tape(DDAF tape) was appled for thin wafer packaging process and it was very efficient for line speed and producibility. And DDAF tape must be have controlled tensile property helpful for easily attach and detach process.
The main drivers for die attach film (DAF) implementation are package miniaturization and die thickness reduction, especially in applications requiring die thickness <100 mum. However, processing of DAF materials presents certain difficulties, especially in dicing of DAF-laminated wafers. This work outlines the challenges in terms of material selection and processing optimization to incorporate DAF into the assembly of a 100 micron thin die Ball Grid Array (BGA) package. Process characterization with material modification was conducted to provide insights on influence of material on assembly processes such as wafer lamination, dicing and die attach. Optimum adhesion of the DAF material to both the dicing tape and die backside is critical to prevent “flying die” during dicing and die pick-up problem during die attachment.
Experiment and Instrument
Number of test can be done in a quick and easy way with our solution. Contact Tasatec for more detail at
Phone: 02 030 5852
Line ID: Tasatec
Conclusion
Dicing tape have gradually combined with DAF tape and it is important to perform three or four types of test, which are Tack, Peel, Tensile, Die shear test.
Tasatec has a machine with Full automatic 3 axis be able to test all of the test in one machine structure.
On more interpretation of Tack pattern, development and enhancing Tape properties would be possible. Using this same equipment not only Tack and Peel force but Compressive properties of substrate and viscosity trends of PSA can be analyzed.
Dicing and DDAF tapes are very precise PSA type, we can save your COST
