We’re proud to be exhibiting at PACK EXPO International 2012
and we want to see you there!
Be sure to visit us in booth number S-1349 to learn more about our company including:
The VeriPac 410 offers non-destructive seal and leak detection for blister packs, sachets and pouches with low headspace. This bench top package integrity leak test system inspects packaging for micro leaks as small as 15 microns with reliability and repeatiability. Test results provide operators with definitive pass/fail, eliminating the subjectivity, cost and waste associated with destructive leak test methods.
Don’t delay, register today*.
PACK EXPO International 2012 in Chicago promises to be an experience like no other, with:
- Over 46,000 attendees from 125 countries, representing over 40 vertical markets
- More than 1,800 exhibitors, covering 1.1 million square feet, showcasing state-of-the-art processing and packaging industry technology and services
- Designated industry pavilions, offering specific solutions to meet specific needs
- Educational sessions, providing the most current analysis and skills-building conducted by industry leaders
- Networking opportunities, encouraging attendees and industry exhibitors to exchange ideas in a relaxed environment
Register today* and join us at McCormick Place October 28 – 31 for PACK EXPO International 2012 in Chicago.* and join us at McCormick Place October 28 – 31 for PACK EXPO International 2012 in Chicago